As electronic devices become increasingly smaller and higher functionality, the precision processing technology required for electronic components is becoming an increasingly important factor in advanced technology industries.
In particular, the high-density integration of semiconductors and the expansion of small electronic devices such as mobile gadget have increased the demand for high-precision and high-density packaging of components.
In order to meet these needs, Maxell's precision electroforming technology EF2 (official name: Electro Fine Forming) is used to form patterns on SUS plates and Si wafers to provide precision electroformed parts in various shapes. Multi-layer electroforming technology enables us to produce a wide range of high precision parts such as nozzles and filters for inkjet printers, molds for electronic parts, micro gears, micro washers and structural parts for micro machines.
Release: August 19, 2021
Features precision product
- Design various shape according to the customer’s requirements
- Form aperture that are smaller than thickness
- Achieve under ±1µm high opening accuracy depend on spec.
- Achieve high hardness around HV500 when made of NiCo
- Control thickness
|Minimum aperture size||0.005mm|
|Aperture size min. tolerance||±0.0003mm|
|Max. metal size||600×700mm|
|NiCo hardness||About HV500|
|Ni hardness||About HV300|
|Plating film type||Cu, Ag, Au, Pt, Pd etc.|
|Surface treatment||Gloss, Matt, Etching roughness, Polish etc.|
|Multi-layer structure||Rader structure, With R etc.|
|Max. aspect ratio (aperture)||Max. 2|
|Max. aspect ratio (rib)||Max. 3|
∗ The above values may depend on specifications and other conditions.
∗ If you have further questions, please send us a message and one of our representatives will be in touch.