SMT Soler Paste Stencil
- Even finishing of pattern apertures due to a large parallel light shielding device.
- High hardness (Hv450 - 550) and quality to last long.
- Smooth and even surface and inside of apertures which enables solder paste to flow well, lower the yield.
- Our original polishing processsing resolves the problem such as paste bleeding.
- The polishing process on the electroforming surface improves the accuracy of dimension of thickness.
|Stencil size (Max.)||660mm × 540mm|
|Thickness||20µm - 500µm|
|Accuracy of Thickness||≤+/-8% of stencil thickness|
|Accuracy of Hole size||≤+/-10% of stencil thickness|
|Accuracy of total pitch||≤+/-20µm for 100mm range|
|Note||available Half etching (pitch: 0.3mm)|