High-Definition Hybrid Stencil (FMM) for OLED Display Panel Deposition
EF2 stencil technology achieves real RGB∗11000ppi
The aperture shape formed by EF2's unique photolithography and plating technologies can achieve real RGB∗1 of 1000ppi, and sharp deposition shape without corner R of the aperture.
Hybrid structure that integrates the invar material frame and the high-definition stencil section reduces man-hours
Maxell has a FMM that integrates an invar material frame with excellent thermal expansion characteristics and a high-definition stencil section formed with EF2 technology, thereby reducing deformation caused by thermal expansion and enabling easy installation in evaporation equipment.
Currently, “the de facto standard” etching process stencil requires each stencil to be put together with micron-level positional accuracy and set in the evaporation equipment, and panel manufacturers that support this process are required to have advanced integrated technology.
On the other hand, our FMM can reduce the man-hours required by panel manufacturers by supplying stencils with integrated frames. Furthermore, Our FMM have the advantage of being able to ensure the accuracy of individual stencils, making it possible to increase the size of stencils by integrating evaporation stencils.
Specification
Item | Spec. |
---|---|
Max. stencil metal size (effective size) | 770×500mm (650×420mm) |
Material | (1)Pattern area: Ni (2)Support frame area: Invar (36Ni) |
Thickness | (1)Pattern area: 10µm (2)Support frame area: 1.0mm |
Opening tolerance /Co-ordinate accuracy | ±2µm/±5µm |
If you have further questions please send us a message and one of our representatives will be in touch.