Transcription Lead of Electroforming method


Lead Frame with our electroforming technology. Formed the Lead and Pad parts on SUS plate by electroforming process.

  1. Glass epoxy board is unnecessary and enables thin package.
  2. Unnecessary for drilling process on glass epoxy board.
  3. Exposed lead parts makes heat loss better.
  4. Possible to convert the original Leadframe mounting device, which equipment investment can be controlled.

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