Stencil: For printing and solder ball bumping
Stencil is a jig (metal plate) used in surface mounting of printed circuit boards.
By allowing paste to pass through the openings provided in the metal plate, printing is performed at designated positions on the substrate.
Maxell's stenclis are products developed and manufactured using the company's electroforming technology. They are sometimes referred to as additive stencils.
They are adopted by semiconductor manufacturers both domestically and internationally for the production of various semiconductor packages.
Maxell's categories of stencil include those for solder ball mounting and printing purposes. The solder ball mounting stencil utilizes Maxell's photolithography, plating, and processing technologies to achieve a special 3D structure for the ball mounting method.
Stencil for Flux/Paste Printing
The stencil is placed on semiconductor wafers or package substrates to print flux for mounting solder balls on the surface of the wafer or substrate.
It enables precise printing with a vertical cross-sectional shape and high-precision hole dimensions.
Stencil for bumping solder balls
It achieves bulk mounting of solder balls with a special support structure. Additionally, by ensuring the planarity of the stencil, it realizes superior mounting rates compared to conventional solder ball mounting stencil (with a dual electroforming structure).
Conventional stencil is nickel plating; however, Maxell's solder ball mounting stencil has utilized NiCo plating for approximately 20 years. The high hardness (around HV500) of NiCo plating contributes to the increased durability of the stencil (resistant to damage and deformation, with a lifespan 3.4 times that of our nickel plating).
∗ Research by Maxell
Maxell supports a portion of sales of electroforming products developed and manufactured with Maxell's precise Electro Fine Forming technologies called "EF2" to plant trees. Maxell has named this program the "Green Stencil Program".
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