Tapes for Semiconductor
We provide the most suitable tapes, mainly UV-cure type, for diversified manufacturing process of semiconductors that market is growing continuously.
Product List
| Model | Product | Application | Features | Tape thickness | Adhesion | Coating |
|---|---|---|---|---|---|---|
| No.636000 | Dicing tape | For all kinds of wafer dicing | 0.100mm | 2.80N/10mm | Single | |
| No.636015 | Dicing tape | For all kinds of substrate dicing | 0.160mm | 2.80N/10mm | Single | |
| No.636020 | Dicing tape | For all kinds of wafer dicing | High fixation power | 0.100mm | 3.20N/10mm | Single |
| No.636025 | Dicing tape | For all kinds of substrate dicing | Easy pick up | 0.160mm | 3.50N/10mm | Single |
| No.636050 | Dicing tape | For all kinds of wafer dicing | Easy pick up | 0.100mm | 2.60N/10mm | Single |
| No.636055 | Dicing tape | For all kinds of substrate dicing | Easy pick up | 0.160mm | 2.90N/10mm | Single |
| No.636095 | Dicing tape | For all kinds of substrate dicing | Easy pick up, Strong adhesion | 0.170mm | 4.10N/10mm | Single |
