MID Maxell method

MID(Molded Interconnect Device)

What is MID Technology? :
A technology for forming circuit patterns and mounting components on three-dimensional
surfaces of resin components.


Process movie of MID Maxell method

MID Maxell method Introduction movie EnglishEnglish
MID Maxell method Introduction movie ChineseChinese


MID Maxell method

A catalyst deactivator is applied to the surface of a molded article made of generic resin, and a pattern is drawn with a laser.
As for the non-drawing area, the catalyst is deactivated by the deactivating layer, and the plating is deposited only in the
drawing area to form a metal wiring.

MID Molded Interconnect Device

This method is original process developed by Maxell.

The MID Maxell method has the potential to be applied to various parts.

Maxell's proprietary MID process using catalytic deactivator and preprocessing

  • It is possible to use a general-purpose resin as a substrate, THE MID coverage is increased
    by controlling the physical properties (electrical, mechanical properties).
  • Mid wiring can be formed on the surface of glass, ceramic, and transparent resin.
  • It is possible to integrate with other technologies such as foam molding and insert molding.
  • It enables upsizing or thinning of MID target parts.
  • It can be applied to existing plating equipment. (Only a basin for catalyst deactivator to be added.)


Process of MID Maxell method

Process of MID Maxell method

Effect of catalyst deactivator

Catalyst deactivation membrane

No catalyst deactivator

No catalyst deactivator

With catalyst deactivator

With catalyst deactivator

Adaptable substrate

BaseTypeStructureMaxell MID methodPurpose
Resin Super engineering plastic PPS ※1),Aromatic polyamide(6TPA),
LCP ※2),PPSU ※3)etc.
Implemented parts
General-purpose engineering plastic Aliphatic polyamide(PA66, PA6PC),
PC ※4)PBT ※5),ABS ※6),SPS ※7)etc.
Antennas, Costumes, Circuits
Thermosetting resin Epoxy resin(Liquid,Transfer molding) Implemented parts,Metal replacement parts,High heat resistance and dimensional applications

Glass, and ceramic

Glass ceramic

Glass substrate(3D),Ceramic base material(Alumina)

(〇) 5G antenna, Display

※1)Poly Phenylene Sulfide ※2)Liquid Crystal Polymer
※3)Poly Phenyl Sulfone ※4)Polycarbonate ※5)Polybutylene Terephthalate
※6)Acrylonitrile-Butadiene-Styrene ※7)Syndiotactic Polystyrene

Application example

Smartphone parts (Antenna, Camera module etc.)

Automotive parts

Medical Parts

Small precision equipment parts (IoT sensing device tec.)


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