MID Maxell method
MID(Molded Interconnect Device)
What is MID Technology? :
A technology for forming circuit patterns and mounting components on three-dimensional
surfaces of resin components.
MID Maxell method
A catalyst deactivator is applied to the surface of a molded article made of generic resin, and a pattern is drawn with a laser.
As for the non-drawing area, the catalyst is deactivated by the deactivating layer, and the plating is deposited only in the
drawing area to form a metal wiring.
![MID Molded Interconnect Device](/en/mid_maxell/img/mid_maxell_01.png)
This method is original process developed by Maxell.
The MID Maxell method has the potential to be applied to various parts.
Maxell's proprietary MID process using catalytic deactivator and preprocessing
- It is possible to use a general-purpose resin as a substrate, THE MID coverage is increased
by controlling the physical properties (electrical, mechanical properties). - Mid wiring can be formed on the surface of glass, ceramic, and transparent resin.
- It is possible to integrate with other technologies such as foam molding and insert molding.
- It enables upsizing or thinning of MID target parts.
- It can be applied to existing plating equipment. (Only a basin for catalyst deactivator to be added.)
Process of MID Maxell method
![Process of MID Maxell method](/en/mid_maxell/img/mid_maxell_02.png)
Effect of catalyst deactivator
Catalyst deactivation membrane
No catalyst deactivator
![No catalyst deactivator](/en/mid_maxell/img/mid_maxell_03.png)
With catalyst deactivator
![With catalyst deactivator](/en/mid_maxell/img/mid_maxell_04.png)
Adaptable substrate
Base | Type | Structure | Maxell MID method | Purpose |
---|---|---|---|---|
Resin | Super engineering plastic | PPS ※1),Aromatic polyamide(6TPA), LCP ※2),PPSU ※3)etc. |
〇 | Implemented parts |
General-purpose engineering plastic | Aliphatic polyamide(PA66, PA6PC), PC ※4)PBT ※5),ABS ※6),SPS ※7)etc. |
〇 | Antennas, Costumes, Circuits | |
Thermosetting resin | Epoxy resin(Liquid,Transfer molding) | 〇 | Implemented parts,Metal replacement parts,High heat resistance and dimensional applications | |
Glass, and ceramic ![]() ![]() Glass substrate(3D),Ceramic base material(Alumina) |
(〇) | 5G antenna, Display |
※1)Poly Phenylene Sulfide ※2)Liquid Crystal Polymer
※3)Poly Phenyl Sulfone ※4)Polycarbonate ※5)Polybutylene Terephthalate
※6)Acrylonitrile-Butadiene-Styrene ※7)Syndiotactic Polystyrene
Application example
Smartphone parts (Antenna, Camera module etc.)
Automotive parts
Medical Parts
Small precision equipment parts (IoT sensing device tec.)