Electroforming

What is EF²?

∗EF²(Electro-Fine-Forming) is registered trademark of Maxell, Ltd..

Stencil: For printing and solder ball bumping

Excellent co-ordinate accuracy and metal post (pillar) by electroforming contribute to solder ball bumping yield rate.

High-Definition Hybrid Stencil (FMM) for OLED Display Panel Deposition

Excellent aperture accuracy stencil with support frame contribute to man-hour reduction and productivity improvement.

Special two-layer electroforming stencil, AVP stencil

Unique two-layer design contribute to productivity by controlling the paste delivery volume, etc.

Lead Frame: Transcription Lead of Electroforming method

Contributes to smaller, thinner, freer design and higher integration of semiconductor packages.

Technology introduction about Electroformed Lead Frame

Precision products

Introduction of nozzles for inkjet printers, and filters, molding die for electronic components, etc.

Wafer Bumping Service

Compound wafer and others are available.

Test wafer

Maxell standard ball-bumped wafers contribute to initial cost reduction.

Package Foundry

Supports packaging such as FOWLP.

Green Stencil Program

Introduce Maxell's tree planting