Overview

Soler Bumping Service on semiconduting wafer (6/8 inches). Enables minor diameter bumping formation for Φ100um and under.

Features

1. Due to the development of special jig, it enables minor bumping formation on semiconducting wafers.

2. Enables minor diameter bumping formation for Φ100um and under.

3. High degree of coplanarity for soler ball bumping

4. Enables Void-free bumping formation using solder ball.

5. Acceptable for small lot order (by single sample)

6. UBM formation possible. (Choice for the material, such as Ni, Au)

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