SEMICON Taiwan 2023
Maxell, Ltd. Functional Materials Division will be exhibiting adhesive tapes used in the manufacturing process of semiconductor at "SEMICON Taiwan 2023", which will be held from September 6th until 8th, 2023 in Taiwan.
Having technologies of adhesive material mixing and clean precision coating, Maxell will solve problems that may be happening in the manufacturing process of semiconductor or electronic components.
- UV Dicing Tape
Having dicing tapes both for wafer and packaging
- Back Grinding Tape
Having back grinding tapes suitable for high-bump wafer
- Heat Resistance UV Dicing Tape
Developing tape capable to be used under temperature as high as 200 degrees C
- Alkali Resistance UV Dicing Tape
Introducing tape having superior alkali resistance