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Maxell, Ltd. Functional Materials Division will be exhibiting adhesive tapes used in the manufacturing process of semiconductor at "SEMICON Taiwan 2022", which will be held from September 14th until 16th, 2022 in Taiwan.

Highlights

Having technologies of adhesive material mixing and clean precision coating, Maxell will solve problems that may be happening in the manufacturing process of semiconductor or electronic components.

Exhibited products

dicing tape
    • UV Dicing Tape

 Having dicing tapes both for wafer and packaging

    • Back Grinding Tape

 Having back grinding tapes suitable for high-bump wafer

    • Heat Resistance UV Dicing Tape

 Developing tape capable to be used under temperature as high as 200 degrees C

    • Alkali Resistance UV Dicing Tape

 Introducing tape having superior alkali resistance

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Related Products

Adhesive tapes products list
Link to SEMICON Taiwan 2021

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