Soler Bump Stencil, "Vella".
Stencil which has higher printing performance with smoother and flatter surface enables the precision bumping on PCB and wafers.
- The surface of aperture became even smoother so that it improved the paste flow greatly.
- Enables to print for the pitch 150µm and under.
|Stencil size (Max.)||660mm × 540mm|
|Thickness||5µm - 90µm|
|Accuracy of thickness||≤5% of stencil thickness (pattern area) / with polishing processing|
|Accuracy of hole size||≤3µm (Squeezee size) / in the case of using Cr glass master|
|Accuracy of total pitch||≤15µm for 100mm / in the case of using glass master|